SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Jun 13, 2024
app pub date -
Feb 20, 2024
filing date -
Mar 25, 2020
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Abstract
The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.
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