LOW PRESSURE MOLDED ARTICLE AND METHOD FOR MAKING SAME
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United States of America Patent
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Issued Date -
Jun 13, 2024
app pub date -
Feb 21, 2024
filing date -
Nov 30, 2018
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.
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International Classification(s)
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B29D:PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FRO....
- G02B:OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02C:SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY ....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
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