HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES
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United States of America Patent
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Issued Date -
Jun 13, 2024
app pub date -
Dec 7, 2022
filing date -
Dec 7, 2022
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Abstract
Heterogeneous package structures comprising photonic components are provided. For example, an exemplary package structure comprises at least one electronic device, at least one photonic device, at least one bridge interconnect device, and at least one optical waveguide device. The at least one bridge interconnect device is configured to electrically connect the at least one electronic device to the at least one photonic device. The at least one optical waveguide device is optically coupled to the at least one photonic device to implement an optical bus for routing optical signals in the package structure. The at least one photonic device is configured to implement an electro-optical interface between the at least one electronic device and the optical bus.
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