PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME
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United States of America Patent
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Issued Date -
Jun 13, 2024
app pub date -
Sep 8, 2023
filing date -
Dec 13, 2022
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Abstract
A pattern inspection apparatus includes a sample including a plurality of holes having thicknesses that are different from each other, an electron gun configured to generate an input electron beam and emit the input electron beam onto a wafer and the sample, a stage configured to support the wafer and the sample, a detector configured to generate a scanning electron microscope (SEM) image by detecting emitted electrons from the wafer and the sample, and a processor configured to process the SEM image into a three-dimensional profiling image containing depth information of the wafer and determine whether a condition of the input electron beam has changed based on the processing of the SEM image.
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