SEMICONDUCTOR MANUFACTURING APPARATUS AND CLEANING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS

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United States of America Patent

APP PUB NO 20240191348A1
SERIAL NO

17908798

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An object of the invention is to provide a technique that can decrease a reaction product or residual HF in a chamber. A semiconductor manufacturing apparatus includes an inlet to introduce a processing gas containing vapor of hydrogen fluoride and vapor of alcohol into a processing room in a processing container, a sample stage disposed in the processing room and having an upper surface on which a wafer to be processed is placed, and an introduction mechanism to introduce a polar molecular gas to the inlet.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH TECH CORPJAPAN TOKYO PORT XIXINQIAO 1 CHOME 24 NO 14

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HATTORI, Takashi Tokyo, JP 165 1633
KUROSAKI, Yosuke Tokyo, JP 23 65
TAKEI, Aki Tokyo, JP 7 12
YAMADA, Masaki Tokyo, JP 229 3715

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