SMART DESOLDERING DEVICE AND METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK DRIVEN BY ARTIFICIAL INTELLIGENCE
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Jun 13, 2024
app pub date -
Nov 14, 2023
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Dec 7, 2022
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Abstract
The invention discloses a smart desoldering device and method for laser removal of substrate solder mask driven by artificial intelligence. The smart desoldering device includes an artificial intelligence (AI) system including a database unit, a learning and training unit, a parameter optimization setting unit, a condition restriction unit and an AI model processing unit, a control processing module, a camera module and a laser desoldering module. The artificial intelligence (AI) system is used to learn and pre-train the types, sizes and thicknesses of substrates, the colors and thickness of solder mask and the depth around solder pads, and automatically optimize and set all processing parameters according to the characteristics of the substrate to be processed. The artificial intelligence (AI) system controls the laser desoldering module to perform laser desoldering on the substrate according to the first control command and a circuit layout diagram.
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