COOLING DEVICE FOR COOLING A SEMICONDUCTOR MODULE AND CONVERTER WITH THE COOLING DEVICE
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United States of America Patent
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Issued Date -
Jun 6, 2024
app pub date -
Feb 16, 2022
filing date -
Mar 31, 2021
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Abstract
A cooling apparatus includes a semiconductor module having first and second cover faces, with the first cover face facing away from the second cover face, a module face between the first and second cover faces, and side faces to enclose the module space. A heat sink cools the semiconductor module and includes a base body. Cooling elements project from a first face of the base body and a cooling medium flows around the cooling elements and the side faces of the semiconductor module in a flow direction along the base body, with a first one of the side faces and a second one of the side faces of the semiconductor module forming a common side edge which faces the flow direction. The semiconductor module is connected to the first face of the base body at the first cover face and is embedded between at least some of the cooling elements.
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