MONOLITHIC SOUND TRANSDUCER AND ENVIRONMENTAL BARRIER
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United States of America Patent
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Issued Date -
Jun 6, 2024
app pub date -
Nov 17, 2023
filing date -
Dec 1, 2022
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Abstract
A method for manufacturing a MEMS microphone device with a monolithically integrated environmental barrier structure includes providing a substrate structure including a base substrate and an additional substrate material layer deposited on the base substrate, creating a micromechanical environmental barrier structure in the substrate structure by applying a microstructuring process, where the micromechanical environmental barrier structure is configured to let a first amount of air pass through while preventing a second amount of at least one of moisture, liquid, oil or solid environmental particles from passing through, and creating a MEMS sound transducer structure in the additional substrate material of the substrate structure by applying a microstructuring process.
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