THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING
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United States of America Patent
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Issued Date -
Jun 6, 2024
app pub date -
Dec 1, 2022
filing date -
Dec 1, 2022
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Abstract
The present disclosure is directed to an apparatus having a bond head configured to heat and compress a semiconductor package assembly, and a bonding stage configured to hold the semiconductor package assembly, wherein the bonding stage comprises a ceramic material including silicon and either magnesium or indium.
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