SYMMETRIC DUMMY BRIDGE DESIGN FOR FLI ALIGNMENT IMPROVEMENT
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United States of America Patent
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Issued Date -
Jun 6, 2024
app pub date -
Dec 5, 2022
filing date -
Dec 5, 2022
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Abstract
Embodiments disclosed herein include package architectures. In an embodiment, the package architecture comprises a package substrate, a first bridge in the package substrate, where the first bridge includes conductive routing, and a second bridge in the package substrate. In an embodiment, the package architecture further comprises a third bridge in the package substrate, where the second bridge and the third bridge are positioned symmetrically about the first bridge.
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