SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 6, 2024
app pub date -
Jun 19, 2023
filing date -
Dec 2, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A semiconductor device includes: a substrate including a first face, on which an active area is formed, and a second face opposite to the first face; an electronic element formed on the active area; a front wiring structure disposed on the first face of the substrate and connected to the electronic element; a trench capacitor filling at least a portion of a back trench extending into the substrate from the second face of the substrate; a back wiring structure disposed on the second face of the substrate and connected to the trench capacitor; and a through-via extending through the substrate to electrically connect the electronic element and the back wiring structure to each other.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully