ELECTROCONDUCTIVE ADHESIVE LAYER
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 6, 2024
app pub date -
Mar 16, 2022
filing date -
Mar 26, 2021
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An object of the present disclosure is to provide a conductive adhesive layer in which the connection stability between objects that are conductive members is excellent, and the connection stability is maintained even when the conductive adhesive layer is subjected to high temperature. The conductive adhesive layer is a conductive adhesive layer including a binder component and conductive particles, wherein the conductive particles include conductive particles A having a median diameter of 100% or more of a thickness of the conductive adhesive layer, and conductive particles B having a median diameter of 1 to 50% of the median diameter of the conductive particles A, a content of the conductive particles is 110 to 900 parts by mass based on 100 parts by mass of the binder component, and a mass ratio of the conductive particles A to the conductive particles B is 0.1 to 7.2.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully