BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS
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Issued Date -
Jun 6, 2024
app pub date -
Feb 13, 2023
filing date -
Dec 5, 2022
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Abstract
Brushes for cleaning wafers after a Chemical Mechanical Polishing (CMP) process and methods for fabricating such brushes are provided. An exemplary method for fabricating a brush for cleaning wafers after a Chemical Mechanical Polishing (CMP) process includes forming a brush configured for contacting the wafers; and, while forming the brush, controlling formation of pores within the brush to a maximum pore dimension, wherein the maximum pore dimension is 1000 nanometers (nm).
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