ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
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United States of America Patent
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Issued Date -
May 30, 2024
app pub date -
Feb 5, 2024
filing date -
Aug 5, 2021
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Abstract
An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.
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