HIGH-BANDWIDTH ANTENNA IN PACKAGE APPARATUS
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United States of America Patent
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May 30, 2024
app pub date -
Feb 7, 2024
filing date -
Oct 26, 2018
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Abstract
This disclosure discloses implementations for high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator, a second radiator, a first substrate, a second substrate, a first metal piece, and a first feeding path. The first radiator and the first feeding path are disposed on the first substrate, the second radiator is disposed on the second substrate, the first feeding path is configured to feed the first radiator, and the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate.
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