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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
PROTEC CO LTD	11-14 SIMIN-DAERO 327BEON-GIL DONGAN-GU ANYANG-SI GYEONGGI-DO 14055

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
AHN, GEUNSIK	Seoul, KR	10	17
# of filed Patents : 10 Total Citations : 17
Ko, Youn Sung	Gyeonggi-do, KR	10	8
# of filed Patents : 10 Total Citations : 8

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Full Text

US Patent Application No: 2024/0178,182

APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING

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Abstract

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A flip-chip laser bonding apparatus and method are provided in which flip-chip type semiconductor chips are bonded to a substrate using laser light. The flip-chip laser bonding apparatus and method are effective in rapidly bonding bent or flexible flip-chip type semiconductor chips to a substrate with high quality without contact defects of solder bumps.

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Description

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