SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240177978A1
SERIAL NO

18511890

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a substrate processing apparatus comprising a processing chamber, a rotatable substrate support configured to hold a substrate in the processing chamber, a freezing device that is in contact with or separated from the substrate support and is configured to cool the substrate support, a mechanism configured to rotate the substrate support and raise and lower the freezing device, a power supply part configured to supply a radio frequency (RF) power, and a power supply line that penetrates through the freezing device, has a contact portion, and is configured to switch supply and stop of supply of the RF power by connecting the contact portion to a specific position of the substrate support or disconnecting the contact portion from the specific position of the substrate support.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDAKASAKA BIZ TOWER 3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIKUCHI, Yusuke Yamanashi, JP 58 197
SHINADA, Masato Tokyo, JP 21 15

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