PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
May 30, 2024
app pub date -
Nov 21, 2023
filing date -
Nov 24, 2022
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Abstract
A photosensitive conductive paste includes a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent. The conductive powder is covered with a glass having a glass softening point (Ts) of 800° C. or lower.
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