PHOTOLITHOGRAPHY PATTERNING METHOD
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United States of America Patent
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Issued Date -
May 30, 2024
app pub date -
Feb 7, 2024
filing date -
Nov 2, 2022
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Abstract
A patterning method includes: forming a first photoresist layer on a substrate; performing first divisional exposure on the first photoresist layer with first exposure energy, higher than or equal to threshold energy, using a reticle having lines and spaces of a mask pattern and an exposure apparatus; and shifting the reticle below a line width of the mask pattern and performing second divisional exposure on the first photoresist layer with second exposure energy, higher than or equal to the threshold energy, using the reticle to form a photoresist pattern. A spatial distribution of the first exposure energy may overlap a spatial distribution of the second exposure energy.
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