INFRARED MODULATOR, OPTICAL DEVICE INCLUDING THE INFRARED MODULATOR, AND OPTICAL COMPUTING SYSTEM INCLUDING THE OPTICAL DEVICE
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United States of America Patent
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Issued Date -
May 30, 2024
app pub date -
May 12, 2023
filing date -
Nov 28, 2022
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Provided is an infrared modulator including a silicon substrate, a multiple buffer layer on the silicon substrate, the multiple buffer layer including indium phosphide (InP), a first type semiconductor layer on the multiple buffer layer, the first type semiconductor layer including InP, a light absorption layer on the first type semiconductor layer, the light absorption layer including a quantum well structure including indium gallium arsenic phosphide (InGaAsP), and a second type semiconductor layer on the light absorption layer, the second type semiconductor layer including InP.
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