LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILICA POWDER, AND METHOD FOR MANUFACTURING LOW DIELECTRIC SILICA POWDER
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United States of America Patent
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May 30, 2024
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Feb 5, 2024
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Jun 2, 2020
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A method for manufacturing a low dielectric silica powder incudes heat-treating a silica powder at a temperature of 500° C. to 1500° C. to achieve 0.0005 or less of a dielectric loss tangent of the silica powder at 10 GHz, and etching a surface of the heat-treated silica powder with an etching solution. A silica powder with an extremely small dielectric loss tangent, a resin composition containing the same, and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesion at the interface to resin are achieved.
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