CONDITIONER AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
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United States of America Patent
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Issued Date -
May 30, 2024
app pub date -
Jun 27, 2023
filing date -
Nov 30, 2022
priority date (Note) -
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Abstract
Provided is a conditioner including a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry, a conditioning disk on the conditioning arm that is configured to condition the polishing pad, a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk, and a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad.
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