METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
May 23, 2024
app pub date -
Sep 25, 2023
filing date -
Nov 22, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.
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