ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED WIRING BOARD
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United States of America Patent
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Issued Date -
May 23, 2024
app pub date -
Mar 17, 2022
filing date -
Mar 29, 2021
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Abstract
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high peel strength when used for a copper-clad laminate or a printed wiring board. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan θ of 0.58 or less as calculated based on a mean height Rc (μm) and a mean width RSm (μm) of profile elements by formula Rc/(0.5×RSm), and a small projected area Rc×RSm of 0.45 μm2 or more and 2.00 μm2 or less that is a product of the mean height Rc (μm) and the mean width RSm (μm) of the profile elements. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value λs and a cutoff value λc.
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