Die-Beam Alignment for Laser-Assisted Bonding
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United States of America Patent
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Issued Date -
May 23, 2024
app pub date -
Jan 31, 2024
filing date -
Mar 17, 2020
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Abstract
A method of making a semiconductor device involves the steps of disposing a first semiconductor die over a substrate and disposing a beam homogenizer over the first semiconductor die. A beam from the beam homogenizer impacts the first semiconductor die. The method further includes the steps of determining a positional offset of the beam relative to the first semiconductor die in a number of pixels, using a first calibration equation to convert the number of pixels into a distance in millimeters, and moving the beam homogenizer the distance in millimeters to align the beam and first semiconductor die.
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