ELECTRONIC DEVICE INCLUDING A DIE ARRANGED BETWEEN FIRST AND SECOND SUBSTRATES
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United States of America Patent
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Issued Date -
May 23, 2024
app pub date -
Jul 3, 2023
filing date -
Nov 21, 2022
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Abstract
An electronic device includes a die mounted between a first substrate and a second substrate. The first substrate includes a first substrate die contact on a first side of the first substrate, and a first substrate terminal contact on a second side of the first substrate opposite the first side, the first substrate terminal contact electrically and thermally connected to the first substrate die contact. The second substrate includes a second substrate die contact on a first side of the second substrate, and a second substrate terminal contact on a second side of the second substrate opposite the first side, the second substrate terminal contact electrically and thermally connected to the second substrate die contact. The die includes a first die element conductively connected to the first substrate die contact, and a second die element conductively connected to the second substrate die contact.
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