ELECTRON BEAM-CURABLE COMPOSITION, AND FOOD PACKAGING MATERIAL
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United States of America Patent
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May 23, 2024
app pub date -
Aug 6, 2021
filing date -
Feb 26, 2021
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Abstract
The invention provides an electron beam-curable composition comprising a (meth)acrylate component (A) containing one or more (meth)acrylate compounds (but excluding silicone-modified compounds), wherein the (meth)acrylate component (A) contains a (meth)acrylate compound (A-1) having a molecular weight of 500 or greater, and the amount of the (meth)acrylate compound (A-1) is at least 70% by mass of the total mass of the composition, and in the (meth)acrylate component (A), the amount of (meth)acrylate compounds having a molecular weight of less than 500 is less than 25% by mass of the total mass of the composition.
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