GRINDING METHOD OF WORKPIECE
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United States of America Patent
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Issued Date -
May 23, 2024
app pub date -
Nov 15, 2023
filing date -
Nov 21, 2022
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Abstract
A grinding method of a workpiece includes a holding step of holding the workpiece on a holding surface of a chuck table, a grinding step of, after the holding step, measuring a thickness of the workpiece in a non-contact region other than a contact region between the workpiece and grinding stones while grinding the workpiece with a grinding wheel including the grinding stones, and a measurement step of, after the grinding step, relatively moving and separating the workpiece and the grinding stones from each other, and measuring the thickness of the workpiece in the contact region during or after the relative movement of the workpiece and the grinding stones.
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