SOLDER BALL SUPPLY DEVICE AND SOLDER BALL SUPPLY METHOD
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United States of America Patent
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Issued Date -
May 23, 2024
app pub date -
Mar 24, 2021
filing date -
Mar 24, 2021
priority date (Note) -
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Abstract
A solder ball supply device is applied to a solder ball feeder including a feeder main body section, a track member, an excitation device, and a cavity unit, and includes an imaging section and a determination section. In the supply region, the cavity unit includes multiple cavities in which one of the multiple solder balls conveyed to the supply region is to be accommodated. The imaging section causes the imaging device to image the cavity unit to which the multiple solder balls are conveyed. The determination section performs image processing on the image data of the cavity unit acquired by the imaging section to determine whether the solder ball can be collected by the component mounter for each of the multiple cavities.
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