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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HAKKO CORPORATION	4-5 SHIOKUSA 2-CHOME NANIWA-KU OSAKA CITY OSAKA 556-0024

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• G06F:ELECTRIC DIGITAL DATA PROCESSING

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Matsuzaki, Kenji	Osaka, JP	35	703
Nakamura, Kenta	Osaka, JP	64	493
Takeuchi, Hitoshi	Osaka, JP	98	1015

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Nov 23, 2027
7.5 Year Payment	$3600.00	$1800.00	$900.00	Nov 23, 2031
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 23, 2035

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2024/0165,726

Composite Soldering, De-Soldering Station and System

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