SIP MODULE
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Apr 19, 2022
filing date -
Apr 21, 2021
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Abstract
A SiP module according to the embodiment comprises: a substrate; an image sensor disposed on one surface of the substrate; and a serializer embedded inside the substrate. The substrate includes a via hole that penetrates through the substrate in order to electrically connect the image sensor and the serializer.
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