CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Oct 4, 2023
filing date -
Nov 15, 2022
priority date (Note) -
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Abstract
A display apparatus includes a silicon substrate including a first surface and a second surface opposite thereto and including an opaque material, a display panel disposed on the first surface of the silicon substrate, a base film including a third surface and a fourth surface opposite thereto, the fourth surface having a portion facing the first surface of the silicon substrate, a display driving chip mounted on the base film, a connector disposed on a portion of the third surface of the base film, and a driving printed circuit board (PCB) electrically connected with the base film, wherein the silicon substrate corresponds to the base film in a one-to-one relationship, and a length of an edge of the base film overlapping the silicon substrate is about 90% of a length of an edge of the silicon substrate parallel to the edge of the base film.
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