PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Nov 15, 2022
filing date -
Nov 15, 2022
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Abstract
Embodiments of a microelectronic assembly includes: an interposer comprising a first portion in contact along an interface with a second portion; a first integrated circuit (IC) die embedded in a dielectric material in the first portion of the interposer; and a second IC die coupled to the first portion of the interposer opposite to the second portion, wherein: the second portion comprises a glass substrate with a channel within the glass substrate, a portion of the channel has an opening at the interface, a conductive pad in the first portion is exposed in the opening, and the conductive pad is coupled to a circuit in at least one of the first IC die or the second IC die.
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