VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Jan 19, 2024
filing date -
Sep 18, 2019
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Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.
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