SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20240162075A1
SERIAL NO

18424223

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present disclosure provides a substrate support. The substrate support comprises: a base; a first dielectric portion, disposed on the base, having a substrate support portion on which a substrate is mounted; and a second dielectric portion, disposed around the first dielectric portion, having an edge ring support portion on which an edge ring is mounted, wherein at least one of the first dielectric portion and the second dielectric portion includes a sprayed layer formed of an insulating material.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKAO, Takeshi Miyagi, JP 105 382
KAWABATA, Atsushi Miyagi, JP 37 589
KAWANISHI, Koji Miyagi, JP 15 185
NAGAYAMA, Akira Miyagi, JP 29 211
TAKAYAMA, Masato Miyagi, JP 17 82

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