CARD ELEMENT, CHIP CARD, AND PROCESS FOR MANUFACTURING A CARD ELEMENT FOR A CHIP CARD
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Mar 23, 2022
filing date -
Mar 25, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A card element for a chip card, includes an outer metal layer with a flat surface interrupted only by a module opening for receiving a chip module. The module opening extends to an inner side and includes a ferrite layer located on the inner side and through which the opening extends. An inner metal layer is disposed on the ferrite layer through which a portion of the module opening has a reduced cross-section extends. A slit extends from a peripheral surface of the inner metal layer to the module opening and extends through the entire thickness of the inner metal layer. A final layer is made of plastic and disposed on the inner metal layer.
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