POLISHING SLURRY COMPOSITION
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Mar 7, 2022
filing date -
Apr 30, 2021
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Abstract
The present disclosure relates to a polishing slurry composition and to a polishing slurry composition including nanoceria abrasive particles and a water-soluble compound including an intramolecular hydrophilic group, and further selectively including at least one from among an amphoteric compound including an intramolecular carboxyl group and amine group, a surface modifier including an organic acid, and a pH adjuster.
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