POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Feb 17, 2022
filing date -
Feb 19, 2021
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Abstract
A precursor composition which can produce a polyimide film with excellent light transmittance, mechanical properties, coefficient of linear thermal expansion and resistance to thermal decomposition; and a polyimide film obtained from the precursor composition. The polyimide precursor composition contains a polyimide precursor with a repeating unit represented by formula (I); an imidazole compound in an amount more than 0.01 mol and 2 mol or less based on one mol of the repeating units of the polyimide precursor, and a solvent.
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