PROCESS FOR HIGH DENSITY SOLDER INTERCONNECT
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United States of America Patent
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Issued Date -
May 16, 2024
app pub date -
Nov 9, 2023
filing date -
Nov 10, 2022
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Abstract
A method of interconnecting multiple components of an electrical assembly with a solder joint that includes the steps of positioning a suspension adjacent to a slider to provide a connection area between the suspension and the slider, wherein the suspension comprises a pre-deposited quantity of solder material with a height that provides for a predefined gap between a lower surface of the slider and an upper surface of the solder material, and applying energy to the solder material to melt the solder material and allow it to move toward and contact the lower surface of the slider.
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