Thin-Film Sensor and Method of Fabricating Thin-Film Sensor
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Nov 9, 2022
filing date -
Nov 9, 2022
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Abstract
The present disclosure provides a thin-film sensor including a top layer passivation including top electrical contacts; an active layer disposed under the top layer, the active layer including an active material; a bottom layer passivation disposed below the active layer and including bottom electrical contacts; and a semiconductor layer disposed around the active layer, such that the semiconducting layer sandwiches the active layer.
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