BIMETAL RETAINING MECHANISMS FOR USE IN ELECTRONIC DEVICES
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Dec 19, 2023
filing date -
Dec 19, 2023
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Abstract
Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.
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