WIRING TRANSFER PLATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRING BODY INTERMEDIATE MATERIAL, AND METHOD FOR MANUFACTURING WIRING BODY
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Mar 16, 2022
filing date -
Mar 22, 2021
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Abstract
A wiring transfer plate for forming wiring to be transferred to another component includes: a base; a plating base material layer formed as a release layer on the base; an insulating layer covering the base with an opening above the plating base material layer; and a projecting structure formed on the insulating layer for forming, in an insulating layer of a component to which the wiring is to be transferred, a via hole for a via electrode.
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