WIRING BODY, MOUNTING SUBSTRATE, METHOD FOR MANUFACTURING WIRING BODY, AND METHOD FOR MANUFACTURING MOUNTING SUBSTRATE
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Mar 16, 2022
filing date -
Mar 22, 2021
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Abstract
A wiring body disposed above a substrate including a conductor includes: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. The material or structure of a lower layer in the via electrode and the material or structure of a lower layer in the wiring are different.
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