Integrated Fan-Out Packages with Embedded Heat Dissipation Structure
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Jan 4, 2024
filing date -
Nov 15, 2017
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Abstract
A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.
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