METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE CASING
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Oct 12, 2023
filing date -
Nov 9, 2022
priority date (Note) -
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Abstract
A carrier tape includes a first area located between first and second pockets and a first long side a second area located between the first and second pockets and a second long side; and a third area located between the first pocket and the second pocket. The third area includes a fourth area located between the first pocket and the second pocket a fifth area located between a first lead accommodating portion of the first pocket and a first lead accommodating portion of the second pocket and a sixth area located between a second lead accommodating portion of the first pocket and a second lead accommodating portion of the second pocket. Further, in a step of attaching a cover tape, the carrier tape and the cover tape are thermocompression bonded to each other at each of the first, second, fifth and sixth areas without thermocompression bonding at the fourth area.
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