Integrated Assemblies and Methods Forming Integrated Assemblies

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United States of America Patent

APP PUB NO 20240153541A1
SERIAL NO

18413671

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Some embodiments include an integrated assembly having first and second source/drain regions laterally offset from one another. Metal silicide is adjacent to lateral surfaces of the source/drain regions. Metal is adjacent to the metal silicide. Container-shaped first and second capacitor electrodes are coupled to the source/drain regions through the metal silicide and the metal. Capacitor dielectric material lines interior surfaces of the container-shaped first and second capacitor electrodes, A shared capacitor electrode extends vertically between the first and second capacitor electrodes, and extends into the lined first and second capacitor electrodes. Some embodiments include methods of forming integrated assemblies.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INCBOISE ID 83706-9698

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Albert P Boise, US 5 1
Fumagalli, Luca Boise, US 24 136
Jacob, Clement Boise, US 7 1
Lee, Che-Chi Boise, US 11 45
McDaniel, Terrence B Boise, US 36 113
Nair, Vinay Boise, US 32 156
Zhang, Kehao Boise, US 3 1

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