SUB-MOUNT, OPTICAL MODULATION MODULE, AND OPTICAL COMMUNICATION DEVICE
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Oct 16, 2023
filing date -
Nov 4, 2022
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Abstract
Disclosed are a sub-mount, an optical modulation module, and an optical communication device. The sub-mount includes a mount substrate, a signal electrode extending in a first direction on the mount substrate, and a ground electrode separated from the signal electrode and disposed on the mount substrate. Here, the ground electrode includes a lower electrode disposed on a bottom surface of the mount substrate and upper electrodes disposed on one side of the mount substrate and connected to the lower electrode through a side surface or the inside of the mount substrate.
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