MULTILAYER PACKAGE ELEMENT, PACKAGE COMPRISING SUCH ELEMENT AND PROCESS FOR MAKING SUCH PACKAGE ELEMENT
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Nov 8, 2023
filing date -
Nov 9, 2022
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Abstract
A package element for containing and exposing a product, having a seat shaped to accommodate a respective product, is described; the package element is obtained by forming a multilayer including paper plies made by a wet process, wherein the multilayer is formed by pressing in a mould at a temperature between 20° C. and 300° C.
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