COMPOSITE BODY COMPRISING SILICON CARBIDE AND METHOD FOR PRODUCING SAME
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United States of America Patent
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Issued Date -
May 9, 2024
app pub date -
Feb 18, 2022
filing date -
Mar 15, 2021
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There is provided a silicon carbide composite body that can be expected to have efficient heat conduction and electrical conduction between bonding base materials. The silicon carbide composite body includes a first base material including silicon carbide having a silicon oxide layer SiOx formed on the surface and a second base material which has an oxide layer MOy with an element M, which is one or more of metals that forms an oxide in the atmosphere (excluding alkali metals and alkaline earth metals), Si, Ge, As, Se, Sb, and C in diamond on the surface, and is bonded to the first base material such that the MOy side faces the SiOx side, and when at least some of C in silicon carbide forms C—O-M bonds and/or at least some of Si in the silicon carbide forms Si—O−M bonds, the second base material is bonded to the first base material.
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