BONDED ABRASIVE WITH LOW WETTING BOND MATERIAL
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 9, 2024
app pub date -
Nov 3, 2023
filing date -
Nov 4, 2022
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The subject application relates to bonded abrasive with low wetting bond material. An abrasive article including a bonded abrasive body having a particular MOR/EMOD ratio associated with a particular bond vol %. The body also can include a) an average Bond Post Area (BPA) of not greater than microns2; b) an average Bond Post Count (BPC) of at least 140 per 1536 mm2; c) an average bond wetting radius of at least 30/microns; or d) a combination of a) and b).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully